Equipment introduction

Copper plating equipment production line is a series of equipment used for copper plating on the surface of the substrate, widely used in electronics, automotive, construction, hardware and other industries. The following is a detailed introduction about copper plating equipment production line: 

I. Production line composition

Copper plating equipment production line mainly consists of pretreatment equipment, copper plating tank, post-treatment equipment, control system and auxiliary equipment and other components.

1. pre-treatment equipment: including cleaning, degreasing, descaling and other devices, used to remove the dirt and oxidized layer on the surface of the substrate, to ensure a good combination of plating and substrate. 2. copper plating tank: it is a copper plating tank, which is used for plating the substrate.

2. copper plating tank: is the core equipment of the copper plating process, usually using electrolysis to reduce copper ions into copper metal and deposited on the surface of the substrate. The design of copper plating tank needs to consider factors such as current distribution uniformity, temperature control of plating solution, and circulation of plating solution.

3. post-treatment equipment: including cleaning, drying, polishing and other devices, used to remove residual plating solution and impurities on the surface of the plating layer, to improve the finish and corrosion resistance of the coating.

4. control system: used to monitor and adjust various parameters in the copper plating process, such as current, voltage, plating solution temperature, plating solution composition, etc., to ensure the stability and consistency of the plating quality.

5. Auxiliary equipments: including traveling car, crane, conveyor belt, etc., used for lifting, transporting, loading and unloading of base material.

II. Working Principle

The working principle of copper plating equipment production line is based on electrolysis principle. In the copper plating tank, the substrate serves as the cathode and the copper plate or ball serves as the anode, and the two are connected through the electrolyte (solution containing copper ions). Under the action of direct current, copper ions dissolve from the anode and migrate to the surface of the cathode, and are reduced to metallic copper and deposited on the substrate, forming a uniform layer of copper plating.