Equipment introduction

A chemical plating line is a type of production line that specializes in depositing layers of copper on the surface of materials by chemical means. Such lines typically include a series of processing steps and equipment for an efficient copper plating process. The following is a detailed overview of the chemical copper plating equipment production line:

I. Line Components

1. Pretreatment Equipment: Used for cleaning, degreasing, descaling and other treatments on the substrate to ensure that the substrate surface is clean and free of impurities to provide good adhesion conditions for subsequent copper plating. This equipment may include cleaning tank, spraying device, ultrasonic cleaning machine and so on.

2. Chemical copper plating tank: This is the core part of the production line, which contains the chemical copper plating solution. Under proper temperature and agitation conditions, the substrate is immersed in the copper plating solution, and a uniform copper layer is deposited on the surface of the substrate by chemical reaction. Copper plating solution usually contains copper ions, reducing agents, complexing agents, stabilizers and other components.

3. Post-treatment equipment: Used for further processing of the copper plated product, such as cleaning, drying, polishing, etc. These steps are designed to remove the copper layer from the surface of the plating. These steps are designed to remove residues from the plated surface and improve the finish and corrosion resistance of the plated layer.

4. Auxiliary equipment: such as heating system, cooling system, stirring device, filtration system, etc., which are used to maintain the temperature, stirring intensity and quality of the plating solution during the copper plating process.

II. Working Principle

Chemical copper plating is a kind of electroless copper plating process, the basic principle is that copper ions in the copper plating solution are reduced to metallic copper under the action of reducing agent and deposited on the surface of the substrate. This process does not require an external power source, but is carried out spontaneously by chemical reactions.