Copper Plating Quality Control: From Thickness Testing to Adhesion Checks
2025-03-01
Key Metrics & Tools
| Parameter | Method | Standard | Frequency |
|---|---|---|---|
| Thickness | XRF | ±10% of target | 5% per batch |
| Adhesion | ASTM B571 cross-cut | No peeling (Grade 0) | First piece daily |
| Porosity | Thermal shock (-40°C↔150°C) | No cracks/blisters | Weekly |
| Roughness | White-light interferometer | Ra≤0.5μm | Monthly |
SPC Implementation
Real-time monitoring of current, temperature, pH (CPK ≥1.33);
Hourly Cu²+/H2SO4 analysis;
Auto-shutdown for anomalies (e.g., depleted anodes).
Client Audit Success
An Apple supplier achieved:
Customer complaints: 1.2% → 0.15%;
IPC-4552A Class 3 certification (high-speed PCB plating);
Annual savings: $180,000 (rework + scrap reduction).