Semiconductor plating equipment (semiconductor plating equipment) needs to achieve ±0.3μm plating uniformity on the wafer surface, in order to meet the performance requirements of 5G chips, MEMS sensors and other high-end components.Leimeng Equip's roll-to-roll electroplating line (roll-to-roll electroplating line) adopts magnetic levitation drive. electroplating line adopts a magnetic levitation drive system with a speed accuracy of ±0.1mm/s, and supports multi-material plating of copper, nickel, gold and other materials. For example, in IC carrier board plating, the copper layer thickness deviation is ≤0.5μm, ensuring signal transmission stability.
Fully automated semiconductor plating machine (automatic plating machine) integrated machine vision and AI algorithms, real-time detection of plating defects (such as pinholes, bubbles), yield rate increased to more than 99.5%. After the introduction of the equipment to a packaging and testing company, production capacity was increased by 35% and manual intervention was reduced by 60%. According to Global Market Insights, the global semiconductor plating equipment market size will expand at a CAGR of 8.2% from 2023-2030, with Asia accounting for more than 50% of the market.
Procurement needs to be concerned:
Cleanliness level: the equipment needs to meet the Class 1000 clean environment standards;
Material compatibility: whether to support advanced processes such as TSV (silicon through-hole) plating;
After-sales service: whether the supplier can provide plating solution formulation optimisation and process training.
Leimeng Equip provides customers with ROI calculation tools. Data shows that the equipment payback period is usually 2-3 years and long-term production costs are reduced by 20-30%.