Uniform current distribution is critical. Traditional equipment often suffers from edge effects (e.g., 15% thinner coatings at edges), but modern lines address this with:
Multi-anode layout: 6-8 adjustable anode plates to limit current density variation to ±5%;
Pulse power technology: Reduces polarization, improving coating density (porosity <0.3%);
Solution circulation: Dual filtration (5μm +1μm) and ±0.5°C temperature control to stabilize Cu²+ concentration at 30-50g/L.
A PLC+HMI system monitors:
Current/voltage: Auto-adjusted per substrate area (20-100A/dm²);
Solution pH: Maintained at 2.5-3.5 to prevent hydrolysis;
Deposition rate: Optimized to 8-12μm/min via Hull cell testing.
A Shenzhen PCB manufacturer upgraded to an automated line, achieving:
Coating uniformity increase: 78% → 95%;
Output: 1,200 panels/hour (0.5m²/panel);
Annual savings: $420,000 in copper consumables.